MediaTek releases latest mobile chip innovation with Dimensity 9300+

MediaTek has lifted the veil on its latest flagship mobile chip, the Dimensity 9300+, promising heightened performance and enhanced artificial intelligence (AI) capabilities. Designed to accelerate on-device generative AI (GenAI) processing, the Dimensity 9300+ introduces a slew of improvements over its predecessor, the Dimensity 9300.

“The Dimensity 9300+ will help us continue to build a rich ecosystem of generative AI applications thanks to the chip’s broad LLM support and on-device LoRA Fusion,” said JC Hsu, corporate SVP at MediaTek. “To enhance these AI experiences, the Dimensity 9300+ offers impressive performance and enhancements to speed up LLM inference, running tokens much faster for a better user experience.”

Dimensity 9300+ is built with an All-Big-Core design leveraging a 3rd generation TSMC 4nm process. The chip boasts impressive specifications, including an Arm Cortex-X4 core operating at up to 3.4 GHz, alongside other Cortex-X4 and Cortex-A720 cores. MediaTek’s innovative NeuroPilot Speculative Decode Acceleration technology contributes to accelerated AI processing, enabling efficient handling of LLMs with up to 33 billion parameters.

Dimensity 9300+ integrates a 2nd generation hardware raytracing engine and an Arm Immortalis-G720 GPU, delivering smooth raytracing experiences at 60 FPS. MediaTek’s HyperEngine technologies further enhance gaming performance, with features like MediaTek Adaptive Gaming Technology (MAGT) extending battery life and MediaTek Network Observation System (NOS) optimizing network concurrency.

The chip’s imaging capabilities are powered by the MediaTek Imagiq 990 ISP facilitating high-quality photo and video capture, even in low-light conditions. Advanced AI videography features and AI depth engine technologies further elevate smartphone content creation.

Developers will appreciate the Dimensity 9300+’s support for a wide range of AI applications, including on-device LoRA Fusion and NeuroPilot LoRA Fusion 2.0, as well as compatibility with the latest LLMs.

The chip ensures fast and reliable connectivity with its 5G R16 modem, supporting up to 7Gbps downlink speeds in various scenarios.